Conferences
  1. Home
  2. Structure
  3. Physical Chemistry and technologies of nanostructures and functional materials
  4. 12. The Department of Contact Phenomena and Nonmetal Materials Soldering
  5. Krasovskaya N.
  6. Article

Definition wetting by free lead alloys of compact materials on the base of copper

V.Krasovskyi,
 
L.Vishnyakov,
 
N.Krasovskaya,
 
V.Kokhanyy
 

I. M. Frantsevich Institute for Problems of Materials Science of the NAS of Ukraine, Omeliana Pritsaka str.,3, Kyiv, 03142, Ukraine
Adhesion of Melts and Brazing of Materials - Kiev: Frantsevich Institute for Problems of Materials Science NASU, 2015, #48
http://www.materials.kiev.ua/article/1865

Abstract

The sessile drop method with “capillary purification” method was applied. The wetting of compact materials on the base of pure copper and bronzes (tin, beryllium, aluminum) by the low temperature solders on the basis of tin was studied. At wetting of bronzes Sn––Ag––Cu solder showed the big activity in comparison with alloys Sn, Sn––Pb, Sn––Bi. Results on wetting by O-2, SAC (Sn––3,2% (mass) Ag––0,7% (mass) Cu) and Sn––Bi alloys of copper and bronzes substrates showed, that copper and beryllium bronze by alloys are wetted better. Sn––Ag––Cu solders, and also Sn/Bi alloys for metallization and soldering of high porous copper net construction were used.


BRAZING MELTS, NET MATERIALS, TIN, ALUMINIUM AND BERYLLIUM BRONZES, WETTABILITY

Publications