Wetting supplied on SiO₂ and aluminium alloy of Cu and Ti––Cu nanocoatings by Sn and In melts

Abstract

The wetting studying of single Ti and double Ti—Cu coatings by metallic melts by the sessile drop method using the method of capillary cleaning during an experiment in vacuum at temperatures of 300––600 °C has been studied. Studies on the wetting of an industrial Al-alloy (Ams) and SiO₂ by lowtemperature solder alloys based on In, Sn and their alloys with Cu and Ag showed that these alloys can be used as solders for brazing an alloy of Amц with quartz. Particular attention should be paid to the possibility of using these metals (Ti, Cu, Ag) as a metallization coating applied to soldered materials, which reduces the temperature of the soldering process.