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Temperature dependence of yield strength in terms of two components of stochastic shear stress field in glide plane in CrCoNiFeMn alloy

M.Lugovy*,
 
D.Verbylo,
 
M.Brodnikovskyy
 

I. M. Frantsevich Institute for Problems of Materials Science of the NAS of Ukraine, Kyiv
nil2903@gmail.com
Usp. materialozn. 2023, 6:15-31
https://doi.org/10.15407/materials2023.06.015

Abstract

The temperature dependence of the yield strength in the multicomponent CrCoNiFeMn alloy was investigated, using computer modelling and taking into account the short-wave and long-wave components of the shear stress field in the glide plane. The yield strength of a multicomponent alloy in the form of a concentrated solid solution without taking into account grain boundary strengthening is determined by three factors: the periodic lattice potential, the short-wave and long-wave components of the field of stochastic shear stresses in the glide plane, which are created by dissolved atoms. The force barriers resulting from the short-wave component will dominate. Overcoming them by dislocation with the assistance of applied stress and thermal activation will be a critical event to start dislocation movement. Barriers resulting from the periodic lattice potential and the long-wave component will be insignificant against the background of the short-wave component. Their effect on the yield strength can be taken into account by terms that do not depend on temperature. Thermal activation analysis of overcoming barriers resulting from a short-wave component, taking into account the probability of direct and reverse jumps through the barrier, gives the opportunity to describe the temperature dependence of the yield strength of a multicomponent alloy in a wide range of temperatures, including in the region of the high-temperature “plateau”. The dependence of the yield strength calculated in this way for the CrCoNiFeMn alloy correlates well with the corresponding experimental data.

 


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DISLOCATION, GLIDE PLANE., MULTICOMPONENT ALLOY, TEMPERATURE DEPENDENCES

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