Effect of annealing on the structure and mechanical properties of plasma-chemical Si-C-N films of hexamethyldisilazane

   
S.N.Dub,
 
V.A.Morozhenko,
 
I.Timofeeva,
 
I.Kossko
 

I. M. Frantsevich Institute for Problems of Materials Science of the NAS of Ukraine, Omeliana Pritsaka str.,3, Kyiv, 03142, Ukraine
Nanostructural Material Science - Kiev: Frantsevich Institute for Problems of Materials Science NASU, 2010, #2
http://www.materials.kiev.ua/article/1655

Abstract

The influence of annealing at temperatures 600, 800 and 1000 °C on the structural and mechanicalal properties of PECVD SiCN films obtained from hexamethyldisilazane is investigated. It was established that the amorphous structure of the films was preserved up to 1000 °C. The investigations of the mechanical properties of the annealed films showed that nanohardness and elastic modulus decreased by 10% and 5%, respectively, with increasing annealing temperature. The studies of the bonding picture by infrared absorption spectroscopy indicate efussion of hydrogen at annealing temperatures higher 600 °C. An increase of annealing temperature up to 1000 °C enhances film oxidation. The tribological investigations based on scratch tests showed that the friction coefficient of the films decreased as annealing temperature was raised.


ANNEALING, FILM STRUCTURE, FRICTION COEFFICIENT, HEXAMETHYLDISILAZANE, MECHANICAL PROPERTIES