Soldering of aluminium by using tin-based solders and reactive fluxes

Abstract

The processes of soldering of aluminium by using tin solders and fluxes containing activators, such as complex tetrafluoroborates (TFB) of metals with nitrogen—containing bases, have been investigated. It is shown that synthesised complex TFB of lead, zinc and cadmium with benzatriazole and morpholine, while interacting with aluminium, form a complex—forming metal coating on its surface, which improves spreading and filling of a capillary gap with the solder. Soldering by using the developed fluxes provides high properties of the joints.