Conferences

Conductive Film Materials Based on Thermally Stable Fluorine-Cotaining Polyamide and Nickel Boride

A.Paustovskiy,
 
B.Rud,
  
E.Telnikov,
 
N.Siman,
 
P.S.Smertenko,
 
V.V.Kremenitskii,
 
Yu.I.Bogomolov
 

I. M. Frantsevich Institute for Problems of Materials Science of the NAS of Ukraine, Krzhizhanovsky str., 3, Kyiv, 03142, Ukraine
Powder Metallurgy - Kiev: Frantsevich Institute for Problems of Materials Science NASU, 2016, #07/08
http://www.materials.kiev.ua/article/2220

Abstract

The development of resistor materials science and, namely, the feasibility to develop a composite film material based on the thermostable polyamide and nickel boride as current-conducting filler, is considered. A process for producing films is developed: the films are obtained by discharging the polymer solution with a pre-dispersed filler onto the glass substrate, followed by forming at 80 °C with subsequent drying at 150 °С until constant weight. The microstructure and topography of the film surface is studied by SEM and AFM. The formation of two-layer composite with the formation of conducting cluster (when the content the conducting phase is >30 wt.%) from the substrate side is shown. Volt-amps diagrams are studied and analyzed by the differential method. The R(T) dependence is obtained and the temperature resistance coefficient is determined; the latter is positive and its value is 1,67 • 10–3 °С–1.


CONDUCTIVITY, FILLER, NICKEL BORIDE, POLYAMIDE MATRIX, TEMPERATURE COEFFICIENT OF RESISTANCE, VOLT–AMPERE CHARACTERISTICS