Conductive Film Materials Based on Thermally Stable Fluorine-Cotaining Polyamide and Nickel Boride

Abstract

The development of resistor materials science and, namely, the feasibility to develop a composite film material based on the thermostable polyamide and nickel boride as current-conducting filler, is considered. A process for producing films is developed: the films are obtained by discharging the polymer solution with a pre-dispersed filler onto the glass substrate, followed by forming at 80 °C with subsequent drying at 150 °С until constant weight. The microstructure and topography of the film surface is studied by SEM and AFM. The formation of two-layer composite with the formation of conducting cluster (when the content the conducting phase is >30 wt.%) from the substrate side is shown. Volt-amps diagrams are studied and analyzed by the differential method. The R(T) dependence is obtained and the temperature resistance coefficient is determined; the latter is positive and its value is 1,67 • 10^–3 °С^–1.