Soldering of the solid alloy by composite solder alloy

Abstract

The use of the composite MF9 solder by low-energy manufacturing method based on the chemical compound Cu₃P in the process chain link in the preparation of an all-in-one joining of plates of h ard alloy (VK3 type) and steel (12Х18Н10Т SU nomenclature) is considered. In the course of the work, the influence of the thickness of the composite solder layer of MF9 on the connection of two bodies was determined when creating the soldering effect under of electromechanical action high power by equipment (STRUM 902). Analysis of the relationship between the type of metallographic structures, microhardness and plate bonding regimes showed that due to the use of composite solder copper-phosphorus MF9 with flux 209, the properties of the components practically do not change.