Kinetics dispersion during annealing in vacuum of thin chromium-copper double-film deposited onto oxide materials


I. M. Frantsevich Institute for Problems of Materials Science of the NAS of Ukraine, Omeliana Pritsaka str.,3, Kyiv, 03142, Ukraine
Adhesion of Melts and Brazing of Materials - Kiev: Frantsevich Institute for Problems of Materials Science NASU, 2019, #52


The kinetics dispersion of thin chromium-copper double films deposited onto leucosapphire, alumina and zirconia ceramics and annealed in vacuum at temperatures up to 1100 °C at different exposure intervals at each temperature (from 5 to 20 min) was studied. The double films consisted of two layers: the first metallized layer was a chromium nanofilm 150 nm thickness deposited onto oxide surface and a 1,5 µm thickness copper layer was deposited onto it, which was supposed to serve as a solder when the metallized oxide samples were joined together. It has been established that these films remain sufficiently dense when they are briefly heated to 1050 °C and after annealing at 1100 °C they decompose immediately into individual droplets that cover more than half of the area of oxide substrates. The kinetic curves of films decomposition on all oxides are constructed depending on the annealing temperature and the exposure time at each temperature.