Soldering of nanosized bus ways: molecular dynamics simulation

V.M.Samsonov,
 
D.G.Zykov
 

Adhesion of Melts and Brazing of Materials - Kiev: Frantsevich Institute for Problems of Materials Science NASU, 2009, #42
http://www.materials.kiev.ua/article/492

Abstract

Soldering of neighboring conductive ways of a nanosized bus, i.e. the bus with the way width of about 1 nm, was simulated using the isothermal molecular dynamics. Conductive ways and dielectric gaps between them were reproduced by a heterogeneous surface with high- and low-energy stripes respectively. The role of main controlling parameters (the solder droplet size, the width of the dielectric gap and other) was investigated.


DIMENSIONAL TIRE, GAP WIDTH, LENNARD-JONES POTENTIAL