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  4. № 03/04 2023
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Improvement of the bond strength IN Al laminates via APB process  using Tin particles 

Om Prakash Agrawal 1,
 
Rosario Mireya Romero-Parra 2,
 
Beneen M. Hussien 3,
 
Doaa Alaa Lafta 4,
 
M. Heydari Vini 5*,
 
S. Daneshmand 6
 

1 GLA University Mathura, India
2 Universidad Continental, Lima, Peru
3 Medical Laboratory Technology Department, College of Medical Technology, The Islamic University, Najaf, Iraq
4 College of Petroleum Engineering, Al-Ayen University, Thi-Qar, Iraq
5 Department of Mechanical Engineering, Mobarakeh Branch, Islamic Azad University, Isfahan, Iran
6 Department of Mechanical Engineering, Majlesi Branch, Islamic Azad University, Majlesi, Isfahan, Iran
m.heydarivini@gmail.com

Powder Metallurgy - Kiev: Frantsevich Institute for Problems of Materials Science NASU, 2023, #03/04
http://www.materials.kiev.ua/article/3581

Abstract

Aluminum metal matrix composites (AMMCs) are a new modern group of composite materials that are becoming more popular in industrial progress. As a solid welding method to fabricate MMCs, accumulative press bonding (APB) is one of the most capable processes. One of the major disadvantages of the APB process is the weak bonding strength. This study utilizes tin (Sn) particles as filler metal to enhance the bonding strength of aluminum laminates. Thus, AA1060 bars with different content of Sn particles (interlayer filler material) were manufactured at various pressing temperatures and APB steps. The peeling test was used to evaluate the bonding strength. It was found that by increasing the number of APB steps and Sn wt.% and pressing temperature, better bonds of higher strength and quality were generated. The bonding strength was improved to 424 N for a sample fabricated with 15 wt.% of Sn particles at 300 °C.  Scanning electron microscopy (SEM) was used to examine the peeling surface of Al/Sn composite samples.


ACCUMULATIVE PRESS BONDING (APB), ALUMINUM, ALUMINUM MATRIX COMPOSITES, BONDING, FILLER, MULTILAYER SAMPLES, SCANNING ELECTRON MICROSCOPY, SN PARTICLES

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