Electroforming of Powder Composites

Abstract

Electrochemical and electrophoretic deposition approaches can be used for electroforming of powder-based composite specimens with complex shape and macroscopically nonuniform internal structure. Electrophoretic deposition of green bodies for near-net shaping of functionally graded ceramic composites and electroforming of heat sinks for electronic chips are considered as application examples. It is shown that electrophoretic forming allows shaping of functionally graded specimens to provide near-net-shape components after sintering. Heat sinks from ceramic foam with copper electroplating provide combination of high thermal conductivity with low thermal expansion coefficient, which is important for reliable fixation of the radiator at a chip surface.