Formation of Copper Deposit under Electrolysis with Surface-Active Agents

I.B.Murashova,
 
N.E.Agarova,
 
A.B.Darintseva,
 
A.V.Lebid,
 
L.M.Yakovleva
 

Powder Metallurgy - Kiev: Frantsevich Institute for Problems of Materials Science NASU, 2010, #01/02
http://www.materials.kiev.ua/article/1473

Abstract

The growth of dendritic deposit under galvanostatic electrolysis is simulated and then a method is developed to analyze its formation in laboratory. The time dependences for cathodic overpotential are plotted and the rod electrode with the deposit is videotaped to establish that copper dendrites form at smaller density of dendritic tip distribution from the solution with surface-active agent F2 than from the solution without additions. This results in higher flowability of the powder. Nevertheless, dendrites formed from the solution with F2 addition have greater tip radii than the deposit from the pure solution. In addition, the dendritic deposit intensively grows for a longer time with F2 addition, thus increasing the yield of powder and decreasing the yield of cathodic scrap. The results from the laboratory experiment have been confirmed by commercial production.


DEPOSIT STRUCTURE, ELECTROLYTIC COPPER POWDER, GALVANOSTATIC ELECTROLYSIS, GROWTH DYNAMICS, SURFACE-ACTIVE AGENT