Effect of Temperature–Rate Strain Conditions on the Power Variables and Structurization during Hot-Forging of the Sintered Cu–2% Ti Billets

Abstract

The effect of temperature–rate strain conditions at the free settlement of the Cu–2% Ti billets sintered in the 100–700 °C temperature range with a strain rate of 0.01 and 0.001 sec^–1 on the power process variables and structurization are studied. It is found out that given the general trend of reducing the stress with increasing strain temperature, some increase in the stress at ~ 400 °C is observed. This is due to the dynamic strain age-hardening, accompanied with the release of the intermediate metastable and coherent Cu₄Ti β'-phase. It is demonstrated that the intensity of compaction at free settlement increases with increasing temperature, strain rate, and starting porosity of the samples. It is observed that with increasing degree of strain of the billet, it occurs a monotonic decrease in the average grain size of copper and crushing of titanium particles, whose intensity increases with the strain rate and temperature increase.