Annealing influence onto disintegration of molybdenum nanofilms deposited onto non­oxide nonmetallic materials  


I. M. Frantsevich Institute for Problems of Materials Science of the NAS of Ukraine, Krzhizhanovsky str., 3, Kyiv, 03142, Ukraine
Adhesion of Melts and Brazing of Materials - Kiev: Frantsevich Institute for Problems of Materials Science NASU, 2017, #50


The studies results of disintegration kinetics of molybdenum nanofilms 100 nm thickness deposited onto substrates surfaces which were made from silicon nitride and aluminium nitride ceramics, carbon glass and monocrystal of silicon carbide and were annealed in a vacuum at temperatures of 1200—1600 ° С during different exposure times at each temperature in interval of 2—20 min a re given. It has been established that from molybdenum nanofilms deposited on non-oxide materials, the film that is the least resistant during annealing is silicon nitride, which are dispersed intensively and began to interact with the substrate surface after annealing at 1300 °C, and the films onto aluminum nitride proved to be the most resistant. The kinetic curves of film dispersion as result of annealing are constructed using of investigations results.