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  4. № 41 2008
  5. P. 53

Free-lead solders for metallization and brazing of copper materials

V.Krasovskyi,
 
L.Vishnyakov,
 
N.Krasovskaya,
 
E. Ivanov
 

I. M. Frantsevich Institute for Problems of Materials Science of the NAS of Ukraine, Omeliana Pritsaka str.,3, Kyiv, 03142, Ukraine
Adhesion of Melts and Brazing of Materials - Kiev: Frantsevich Institute for Problems of Materials Science NASU, 2008, #41
http://www.materials.kiev.ua/article/293

Abstract

The wettability of copper substrate by low temperature solders on basis of tin was studied. The sessile drop method with “capillary purification” method was applied Sn-Ag-Cu solders, and also Sn-Bi alloys for metallization and soldering of high porous copper net construction were used. Technological process out in vacuum or on air, using organic fluxes should be carried out.


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