Kinetics of dispersion of copper nanofilms deposited onto oxygen-free inorganic materials which was a result of annealing them in vacuum

 
B.Kostyuk,
  
V. Tkach,
 
T. Belyaeva
 

I. M. Frantsevich Institute for Problems of Materials Science of the NAS of Ukraine, Krzhizhanovsky str., 3, Kyiv, 03142, Ukraine
Adhesion of Melts and Brazing of Materials - Kiev: Frantsevich Institute for Problems of Materials Science NASU, 2011, #44
http://www.materials.kiev.ua/article/622

Abstract

Dispersion kinetics which is proceeds in copper nanofilms by thickness of 100 nm deposited onto oxygen-free inorganic materials as a result of them annealing in vacuum at temperatures 800-1000°С during various time is investigated. It is revealed that copper nanofilms during of annealing at 800 °C remain practically without changes on all three investigated materials even at long annealing. Some changes of copper films morphology are observed during annealing at 900°С not less than 10 min duration, and already after 20 min annealing copper films deposited onto all samples are dispersed essentially. After increasing of annealing temperature copper films from 900 up to 1000°C dispersion process was intensified considerably on all materials.


ANNEALING, COPPER NANOFILMS, DISPERGATION, KINETICS, OXYGEN-FREE INORGANIC MATERIALS