Conferences

Thermal Stability of Nanosized Composite C/Cu Films

  

I. M. Frantsevich Institute for Problems of Materials Science of the NAS of Ukraine, Krzhizhanovsky str., 3, Kyiv, 03142, Ukraine
Powder Metallurgy - Kiev: Frantsevich Institute for Problems of Materials Science NASU, 2010, #01/02
http://www.materials.kiev.ua/article/1497

Abstract

The behavior of composite C/Cu/C film, which is deposited by dc magnetron sputtering and in which the nanosized copper particles are located between two layers of amorphous carbon, is studied during annealing at 600 °C in vacuum. The structural evolution is examined by transmission electron microscopy and electron diffraction. The structure of the composite film is found to be stable in annealing up to 15 h. The diffusion coalescence of copper particles is virtually restricted by the specific micro-structure of carbon matrix.


AMORPHOUS CARBON, DIFFUSION COALESCENCE, ELECTRON DIFFRACTION, ELECTRONIC MICROSCOPY, FILMS, STRUCTURE