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  4. № 43 2010
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Wetting kinetics and contact interaction in the semiconductor barium titanate - adhesive-active Cu-Sn-Ti alloys system

N.Grigorenko,
 
T.Sydorenko,
 
V.Poluyanska,
 
E.Chernigovtcev
 

I. M. Frantsevich Institute for Problems of Materials Science of the NAS of Ukraine, Omeliana Pritsaka str.,3, Kyiv, 03142, Ukraine
Adhesion of Melts and Brazing of Materials - Kiev: Frantsevich Institute for Problems of Materials Science NASU, 2010, #43
http://www.materials.kiev.ua/article/503

Abstract

The wetting kinetics of Cu-Sn-Ti alloys (10-50% (at.)) Ti) over perovskite ceramics surfaces was studied by means of a photo- and high-speed filming in a vacuum at 1273 K. The interface microstructure of BaTiO3-?-Cu-Sn-Ti melts was also investigated. Data obtained for above systems with differernt content of titanium were analyzed and compared.


ADHESIVE-ACTIVE ALLOY, CONTACT INTERACTION, PEROVSKITE CERAMICS, PROFILE FILMING, SPREADING KINETICS, WETTABILITY

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