Wetting kinetics and contact interaction in the semiconductor barium titanate - adhesive-active Cu-Sn-Ti alloys system

    

I. M. Frantsevich Institute for Problems of Materials Science of the NAS of Ukraine, Krzhizhanovsky str., 3, Kyiv, 03142, Ukraine
Adhesion of Melts and Brazing of Materials - Kiev: Frantsevich Institute for Problems of Materials Science NASU, 2010, #43
http://www.materials.kiev.ua/article/503

Abstract

The wetting kinetics of Cu-Sn-Ti alloys (10-50% (at.)) Ti) over perovskite ceramics surfaces was studied by means of a photo- and high-speed filming in a vacuum at 1273 K. The interface microstructure of BaTiO3-?-Cu-Sn-Ti melts was also investigated. Data obtained for above systems with differernt content of titanium were analyzed and compared.


ADHESIVE-ACTIVE ALLOY, CONTACT INTERACTION, PEROVSKITE CERAMICS, PROFILE FILMING, SPREADING KINETICS, WETTABILITY